Movable body apparatus, exposure apparatus, and device manufacturing method

ABSTRACT

A stage device is equipped with two stages that can move along an XY plane above a stage base, a first magnet unit and a second magnet unit provided in the two stages, respectively, a planar motor which has a coil unit including a plurality of coils arranged two-dimensionally above the stage base that drives the two stages by a driving force generated by electromagnetic interaction with each of the first magnet unit and the second magnet unit. In a state where the two stages are in proximity within a predetermined distance or in contact with each other above the stage base in a Y-axis direction, a layout of magnets is decided so that no magnets structuring the first magnet unit and no magnets structuring the second magnet unit simultaneously face the same coil structuring the coil unit.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to movable body apparatuses, exposureapparatuses, and device manufacturing methods, and more particularly toa movable body apparatus equipped with two movable bodies driven by aplanar motor, an exposure apparatus equipped with the movable bodyapparatus, and a device manufacturing method using the exposureapparatus.

2. Description of the Background Art

Conventionally, in a lithography process for manufacturing electrondevices (microdevices) such as a semiconductor device (integratedcircuit and the like), a liquid crystal display device and the like,various exposure apparatuses are used. For example, as an exposureapparatus used for manufacturing a semiconductor device, a liquidimmersion exposure apparatus is known which performs exposure on a wafervia an optical system and a liquid. As this type of exposure apparatus,for example, a type of a liquid immersion exposure apparatus which isequipped with a wafer stage on which a wafer is mounted and ameasurement stage on which a measurement member is provided (refer to,for example, U.S. Patent Application Publication No. 2008/0088843), anda twin wafer stage type liquid immersion exposure apparatus which isequipped with two wafer stages (refer to, for example, U.S. PatentApplication Publication No. 2011/0025998) and the like are known.

In the liquid immersion exposure apparatus disclosed in U.S. PatentApplication Publication No. 2008/0088843, in order to constantly hold aliquid immersion area directly below a projection optical system,delivery of the liquid immersion area is performed between themeasurement stage and the wafer stage in a state where the measurementstage and the wafer stage are in contact or in proximity within apredetermined distance. Further, in the liquid immersion exposureapparatus disclosed in U.S. Patent Application Publication No.2011/0025998, for a similar purpose, delivery of the liquid immersionarea is performed between the two wafer stages in a state where the twowafer stages are in contact with each other or in proximity within apredetermined distance.

While the size of the wafer stage is increasing along with the increasein size of the wafer, as a driving source of future wafer stages, planarmotor is said to be promising. However, in the case of employing aplanar motor as a driving source of the wafer stage and the like,especially a moving-magnet-type planar motor in the liquid immersionexposure apparatus of the same type as in, for example, U.S. PatentApplication Publication No. 2008/0088843, U.S. Patent ApplicationPublication No. 2011/0025998 and the like, when the two stages are inproximity for the delivery of the liquid immersion area previouslydescribed, the two stages each have a magnet that faces the same coilwhich generates an electric field (magnetic field) that may act on themagnets of both stages (for example, electromagnetic interaction), whichin turn may make driving the two stages independently and in a stablemanner difficult.

SUMMARY OF THE INVENTION

According to a first aspect of the present invention, there is provideda first movable body apparatus, comprising: a first movable body whichcan move along a two-dimensional plane above a stage base; a secondmovable body which can move along the two-dimensional planeindependently from the first movable body above the stage base; and aplanar motor which has a first magnet unit including a plurality ofmagnets provided in the first movable body, a second magnet unitincluding a plurality of magnets provided in the second movable body,and a coil unit including a plurality of coils arrangedtwo-dimensionally above the stage base, and drives the first movablebody by a driving force generated by an electromagnetic interactionbetween the first magnet unit and the coil unit and drives the secondmovable body by a driving force generated by an electromagneticinteraction between the second magnet unit and the coil unit, wherein aplacement of the plurality of magnets in the periphery of each of thefirst magnet unit and the second magnet unit on the first movable bodyor the second movable body is decided according to a size and aplacement of coils of the coil unit, so that no magnets structuring thefirst magnet unit and no magnets structuring the second magnet unitsimultaneously face the same first direction driving coil structuringthe coil unit, in a state where the first movable body and the secondmovable body are in a first state of being positioned within apredetermined range above the stage base and in proximity within apredetermined distance or in contact with each other in a firstdirection parallel to the two-dimensional plane, and also in a statewhere the first movable body and the second movable body are at least ina predetermined positional relation in a second direction orthogonal tothe first direction within the two-dimensional plane.

According to this apparatus, the first movable body and the secondmovable body can be driven in a stable manner within the predeterminedplane independently from each other.

According to a second aspect of the present invention, there is provideda second movable body apparatus, comprising: a first movable body whichcan move along a two-dimensional plane above a stage base; a secondmovable body which can move along the two-dimensional planeindependently from the first movable body above the stage base; and aplanar motor which has a first magnet unit including a plurality ofmagnets provided in the first movable body, a second magnet unitincluding a plurality of magnets provided in the second movable body,and a coil unit including a plurality of coils arrangedtwo-dimensionally above the stage base, and drives the first movablebody by a driving force generated by an electromagnetic interactionbetween the first magnet unit and the coil unit and the second movablebody by a driving force generated by an electromagnetic interactionbetween the second magnet unit and the coil unit, wherein a placement ofthe plurality of magnets in the periphery of each of the first magnetunit and the second magnet unit on the first movable body or the secondmovable body is decided according to a size and a placement of coils ofthe coil unit, so that an electromagnetic interaction occurs between amagnetic field generated by a predetermined coil structuring the coilunit and magnets structuring the first magnet unit, and anelectromagnetic interaction does not occur between the magnetic fieldgenerated by the predetermined coil and magnets structuring the secondmagnet unit, in a state where the first movable body and the secondmovable body are in a first state of being positioned within apredetermined range above the stage base and in proximity within apredetermined distance or in contact with each other in a firstdirection parallel to the two-dimensional plane, and also in a statewhere the first movable body and the second movable body are at least ina predetermined positional relation in a second direction orthogonal tothe first direction within the two-dimensional plane.

According to this apparatus, the first movable body and the secondmovable body can be driven in a stable manner within the predeterminedplane independently from each other.

According to a third aspect of the present invention, there is provideda third movable body apparatus, comprising: a first movable body whichcan move along a two-dimensional plane above a stage base; a secondmovable body which can move along the two-dimensional planeindependently from the first movable body above the stage base; and aplanar motor which has a first magnet unit including a plurality ofmagnets provided in the first movable body, a second magnet unitincluding a plurality of magnets provided in the second movable body,and a coil unit including a plurality of coils arrangedtwo-dimensionally above the stage base, and drives the first movablebody by a driving force generated by an electromagnetic interactionbetween the first magnet unit and the coil unit and the second movablebody by a driving force generated by an electromagnetic interactionbetween the second magnet unit and the coil unit, wherein a total of adistance from an end on one side of the first movable body to an end onone side of the first magnet unit and a distance from the end on theother side of the second movable body to an end on the other side of thesecond magnet unit, in a first direction parallel to the two-dimensionalplane, includes a length which is at least one coil length in the firstdirection.

According to this apparatus, the first movable body and the secondmovable body can be driven in a stable manner within the predeterminedplane independently from each other.

According to a fourth aspect of the present invention, there is providedan exposure apparatus which exposes an object with an energy beam via anoptical system and liquid, the apparatus comprising: at least one of afirst movable body apparatus and a second movable body apparatus whereinthe object is mounted on the first movable body or the second movablebody, or on the first movable body and the second movable body; and aliquid immersion device which supplies liquid to an area directly belowthe optical system and forms a liquid immersion area between the opticalsystem and the first movable body or the second movable body, or theoptical system and the first movable body and the second movable body,wherein delivery of the liquid immersion area is performed between thefirst movable body and the second movable body when the first movablebody and the second movable body are in the first state.

According to this apparatus, the gap distance between the first movablebody and the second movable body can be constantly maintained, whichkeeps the first movable body and the second movable body from colliding,and keeps the liquid from leaking through the gap between the movablebodies.

According to a fifth aspect of the present invention, there is provideda device manufacturing method, including: exposing a sensitive objectusing the exposure apparatus described above; and developing the objectwhich has been exposed.

BRIEF DESCRIPTION OF DRAWINGS

In the accompanying drawings;

FIG. 1 is a view schematically showing a structure of an exposureapparatus related to an embodiment;

FIG. 2 is a view showing a stage device of FIG. 1;

FIG. 3 is a planar view showing an enlarged view of a measurement stageof FIG. 2;

FIG. 4 is a view used for describing a positional relation between acoil unit and a magnet unit in a state where a wafer stage and ameasurement stage are in proximity or are in contact;

FIG. 5 is a view showing a bottom surface view of the wafer stage andthe measurement stage in the state of FIG. 4;

FIG. 6 is a block diagram showing an input/output relation of a maincontroller which mainly structures a control system of the exposureapparatus related to the embodiment;

FIG. 7 is a view used for describing an operation of the exposureapparatus related to the embodiment;

FIG. 8 is a view used for describing a first modified example; and

FIG. 9 is a view used for describing a second modified example.

DESCRIPTION OF THE EMBODIMENTS

Hereinafter, an embodiment is described, based on FIGS. 1 to 7.

FIG. 1 schematically shows a structure of an exposure apparatus 100related to the embodiment. This exposure apparatus 100 is a scanningexposure apparatus of a step-and-scan method, or a so-called scanner. Asit will be described later on, in the present embodiment, a projectionoptical system PL is provided, and hereinafter, a direction parallel toan optical axis AX of this projection optical system PL will bedescribed as a Z-axis direction, a direction in which a reticle and awafer are relatively scanned within a plane orthogonal to the Z-axisdirection will be described as a Y-axis direction, a directionorthogonal to the Z-axis and the Y-axis will be described as an X-axisdirection, and rotation (tilt) directions around the X-axis, the Y-axis,and the Z-axis will be described as θx, θy, and θz directions,respectively.

Exposure apparatus 100 is equipped with an illumination system ILS, areticle stage RST which moves in a predetermined scanning direction (inthis case, the Y-axis direction which is the lateral direction withinthe page surface of FIG. 1) holding a reticle R illuminated by anillumination light for exposure (hereinafter, shortly referred to asillumination light) IL from illumination system ILS, a projection unitPU including projection optical system PL which projects illuminationlight IL emitted from reticle R on a wafer W, a stage device 150including a wafer stage WST on which wafer W is mounted and ameasurement stage MST used for measurement for performing exposure, acontrol system for these parts and the like.

As disclosed in, for example, U.S. Patent Application Publication No.2003/0025890 and the like, illumination system ILS includes a lightsource, and an illumination optical system which has an illuminanceequalizing optical system including an optical integrator and the likeand a reticle blind and the like (none of which are shown). Illuminationsystem ILS illuminates a slit-shaped illumination area IAR on reticle Rset (limited) by the reticle blind (also called a masking system) withillumination light (exposure light) IL at an illuminance almost uniform.Here, as illumination light IL, as an example, an ArF excimer laser beam(wavelength 193 nm) is used.

On reticle stage RST, reticle R on which a circuit pattern and the likeis formed on its pattern surface (a lower surface in FIG. 1) is fixed,for example, by vacuum chucking. Reticle stage RST can be finely drivenwithin an XY plane and can also be driven in a predetermined scanningdirection (in this case, the Y-axis direction which is the lateraldirection within the page surface of FIG. 1) at a designated scanningvelocity, for example, by a reticle stage driving system 55 including alinear motor and the like.

Position information (including rotation information in the θzdirection) within the XY plane of reticle stage RST is constantlydetected, for example, at a resolution of around 0.25 nm, by a reticlelaser interferometer (hereinafter referred to as a “reticleinterferometer”) 52, via a movable mirror 65 (a Y movable mirror (or aretroreflector) which has a reflection surface orthogonal to the Y-axisdirection and an X movable mirror which has a reflection surfaceorthogonal to the X-axis direction are actually provided). Measurementvalues of reticle interferometer 52 are sent to a main controller 20,and main controller 20 controls the position (and velocity) in theX-axis direction, the Y-axis direction and the θz direction (rotationdirection around the Z-axis) of reticle stage RST via reticle stagedriving system 55, based on the measurement values of reticleinterferometer 52.

Above reticle R, a pair of reticle alignment detection systems RAa andRAb, consisting of a TTR (Through The Reticle) alignment system whichuses light of the exposure wavelength to simultaneously observe a pairof reticle alignment marks on reticle R and a pair of fiducial marks(hereinafter called “a first fiducial mark”) on a fiducial mark plate FM(refer to FIG. 2 and the like) provided on measurement stage MSTcorresponding to the pair of reticle alignment marks via projectionoptical system PL, is provided set apart by a predetermined distance inthe X-axis direction. As reticle alignment detection systems RAa andRAb, a system having a structure similar to the one disclosed in, forexample, U.S. Pat. No. 5,646,413 and the like is used.

Projection unit PU is placed below reticle stage RST in FIG. 1.Projection unit PU includes a lens barrel 140, and projection opticalsystem PL consisting of a plurality of optical elements held at apredetermined positional relation within lens barrel 140. As projectionoptical system PL, for example, a dioptric system consisting of aplurality of lenses (lens elements) that have a common optical axis AXin the Z-axis direction is used. Projection optical system PL, forexample, is telecentric on both sides, and has a predeterminedprojection magnification (e.g., ¼ times, ⅕ times or ⅛ times). Therefore,when illumination area IAR on reticle R is illuminated by illuminationlight IL from illumination system ILS, by illumination light IL passingthrough reticle R placed so that a first plane (object plane) ofprojection optical system PL and the pattern surface are substantiallycoincident, a reduced image of the circuit pattern (a reduced image of apart of the circuit pattern) within illumination area IAR of reticle Ris formed via projection optical system PL (projection unit PU), in anarea (hereinafter, also called an exposure area) IA which is conjugateto illumination area IAR on wafer W which is placed on a second surfaceplane (an image plane) side of projection optical system PL and whosesurface is coated with a resist (sensitive agent). And, by synchronouslydriving reticle stage RST and wafer stage WST, reticle R is relativelymoved in the scanning direction (the Y-axis direction) with respect toillumination area IAR (illumination light IL), while wafer W isrelatively moved in the scanning direction (Y-axis direction) withrespect to exposure area IA (illumination light IL9, and scanningexposure of a shot area (divided area) on wafer W is performed,transferring the pattern of reticle R on the shot area. That is, in thepresent embodiment, the pattern of reticle R is generated on wafer W byillumination system ILS and projection optical system PL, and thepattern is formed on wafer W by exposing a sensitive layer (resistlayer) on wafer W with illumination light IL.

Incidentally, in exposure apparatus 100 related to the presentembodiment, because exposure is performed applying a liquid immersionmethod, an opening on the reticle side becomes larger with thesubstantial increase of numerical aperture NA. Therefore, in a dioptricsystem structured only of lenses, it becomes difficult to satisfy thePetzval condition, which tends to lead to an increase in size of theprojection optical system. In order to avoid such an increase in size ofthe projection optical system, a reflection/refraction system (acatodioptric system) which includes a mirror and a lens can be used.

Further, in exposure apparatus 100 related to the present embodiment, inthe vicinity of a lens (hereinafter also referred to as a “tip lens”)191 which is a terminal optical element closest to the image plane side(wafer W side) that structures projection optical system PL, a liquidsupply nozzle 131A and a liquid recovery nozzle 131B that structure apart of a liquid immersion device 132 are provided.

To liquid supply nozzle 131A, a liquid supply device 138 (not shown inFIG. 1, refer to FIG. 6) is connected via a supply pipe not shown, andto liquid recovery nozzle 131B, a liquid recovery device 139 (not shownin FIG. 1, refer to FIG. 6) is connected via a recovery pipe not shown.

In the present embodiment, a liquid Lq for liquid immersion (refer toFIG. 1) is to be made using pure water that transmits the ArF excimerlaser beam (light with a wavelength of 193 nm). Pure water can beobtained in large quantities at a semiconductor manufacturing plane andthe like without difficulty, and it also has an advantage of havinglittle adverse effect on the resist on wafer W and to the optical lensesand the like. Refractive index n of pure water with respect to the ArFexcimer laser beam is around 1.44. In such pure water, the wavelength ofillumination light IL is shortened to 193 nm×1/n=around 134 nm.

Liquid immersion device 132 including liquid supply nozzle 131A andliquid recovery nozzle 131B is controlled by main controller 20 (referto FIG. 6). Main controller 20 supplies liquid Lq to a space between tiplens 191 and wafer W via liquid supply nozzle 131A, and also recoversliquid Lq from the space between tip lens 191 and wafer W via liquidrecovery nozzle 131B. On this operation, main controller 20 performscontrol so that the quantity of liquid Lq supplied to the space betweentip lens 191 and wafer W from liquid supply nozzle 131A constantlyequals the quantity of liquid Lq recovered from the space via liquidrecovery nozzle 131B. Accordingly, a constant quantity of liquid Lq isheld in the space between tip lens 191 and wafer W (refer to FIG. 1),and by this constant quantity of liquid, a liquid immersion area 14 isformed (e.g., refer to FIG. 2). In the case, liquid Lq held in the spacebetween tip lens 191 and wafer W is constantly replaced.

Incidentally, it is possible to fill liquid Lq in a space betweenmeasurement table MTB and tip lens 191 similarly to the descriptionabove, or, in other words, to form a liquid immersion area, also in thecase when measurement stage MST is positioned below projection unit PU.

On the +Y side of projection unit PU, as is shown in FIG. 1, an off-axisalignment system (hereinafter shortly referred to as an “alignmentsystem”) ALG is provided which optically detects marks subject todetection such as alignment marks and the like on wafer W. Incidentally,as alignment system ALG, although sensors of various kinds of methodscan be used, in the present embodiment, a sensor of an image processingmethod is used. Incidentally, sensors of the image processing method aredisclosed in, for example, U.S. Pat. No. 5,493,403 and the like. Imagingsignals from alignment system ALG are supplied to main controller 20(refer to FIG. 6).

As shown in FIGS. 1 and 2, stage device 150 is equipped with a baseboard 12, a stage base 21 placed on base board 12, wafer stage WST andmeasurement stage MST placed above stage base 21, an interferometersystem 118 (refer to FIG. 6) which measures the position of the twostages WST and MST described above, and a stage driving system 124(refer to FIG. 6) for driving the two stages WST and MST describedabove.

Base board 12 is supported substantially horizontal (parallel to the XYplane) on a floor surface F via a vibration isolation mechanism (notshown). Stage base 21 is supported on base board 12 via air bearings(not shown). In the upper part of stage base 21, a stator 60 (refer toFIG. 4) which will be described later on is housed. In the presentembodiment, stage base 21 functions as a counter mass when driving waferstage WST and when driving measurement stage MST, as it will bedescribed later on. Accordingly, a trim motor for driving stage base 21so that the moving amount of stage base 21 from a reference positionfalls within a predetermined range can be provided between stage base 21and base board 12.

Wafer stage WST and measurement stage MST are each driven independentfrom each other by stage driving system 124. Position information ofwafer stage WST and measurement stage MST in directions of six degreesof freedom (in each of the X-axis, the Y-axis, the Z-axis, the θx, theθy, and the θz directions) is detected by interferometer system 118.Incidentally, in FIG. 1, only a Y-axis interferometer 116 for measuringthe position of wafer stage WST in the Y-axis direction and a Y-axisinterferometer 117 for measuring the position of measurement stage MSTin the Y-axis direction are shown for the sake of simplicity of thedescription. Measurement values of interferometer system 118 are sent tomain controller 20, and main controller 20 controls the position (andvelocity) of wafer stage WST and measurement stage MST via stage drivingsystem 124, based on the measurement values of interferometer system118. Incidentally, stage driving system 124 will be described furtherlater on.

As shown in FIG. 1, wafer stage WST is equipped with a wafer stage mainsection 91, and wafer table W′E′B fixed on wafer stage main section 91.In the present embodiment, as shown in FIG. 4, a planar motor consistingof stator 60 housed in the upper part of stage base 21 and a magnet unit51A fixed to a bottom portion (a side on a surface facing the base) ofwafer stage main section 91 is used as a wafer stage driving system 50A(refer to FIG. 6).

On wafer table WTB, a wafer holder (not shown) is provided which holdswafer W by vacuum suction and the like. This wafer holder is equippedwith a plate shaped main section, and a plate 93 fixed to the uppersurface of the main section that has a large circular opening formed inthe center which is around 0.1 to 2 mm larger in diameter than thediameter of wafer W (refer to FIGS. 1 and 2). At an area in the mainsection within the circular opening of plate 93, a large number of pinsare placed, and by the large number of pins, wafer W is vacuum suctionedin a supported state. In this case, in the state where wafer W is vacuumsuctioned, the wafer W surface and the surface of plate 93 substantiallybecome the same height. The surface of all of the surfaces of plate 93is coated with a liquid repellent material (water repellent material) afluorine-based resin material, an acrylic-based resin material or thelike, and a liquid repellent film is formed. Further, on the surface ofwafer W, a resist (sensitive material) is coated, and the resist whichis coated forms a resist film. In the case, the resist film ispreferably a resist film which is liquid repellent to liquid Lq used forliquid immersion. Further, a top coat film (layer) can be formed on thesurface of wafer W so as to cover the resist film. As the top coat film,it is desirable to use a film which is liquid repellent to liquid Lqused for liquid immersion.

Incidentally, a wafer stage can also be used which is equipped with awafer stage main section that is movable in directions of three degreesof freedom within the XY plane, and a wafer table mounted on wafer stagemain section via a Z-leveling mechanism not shown (including an actuatorsuch as, for example, a voice coil motor and the like) that is finelymovable in the Z-axis direction, the θx direction and the θy directionwith respect to the wafer stage main section.

As shown in FIG. 1, measurement stage MST is equipped with a measurementstage main section 92, and measurement table MTB fixed onto measurementstage main section 92. In the present embodiment, as shown in FIG. 4, aplanar motor consisting of stator 60 and a magnet unit 51B fixed to abottom portion (a side on a surface facing the base) of measurementstage main section 92 is used as a measurement stage driving system 50B(refer to FIG. 6).

Measurement table MTB includes a hollow rectangular solid shaped housingwhose upper surface is open, and a plate member 101 (refer to FIG. 3)having a predetermined thickness formed of a material having liquidrepellency such as, for example, polytetrafluoroethylene (Teflon(registered trademark)) that blocks the upper surface of the housing,and has a rectangular solid shaped appearance whose dimension in theheight direction is much smaller than the dimension in the widthdirection and in the depth direction.

As shown in FIG. 3, in plate member 101, an opening 101 a which is arectangle whose longitudinal direction is in the Y-axis direction, anopening 101 b which is a rectangle that has substantially the samedimension in the X-axis direction as opening 101 a with the X-axisdirection serving as the longitudinal direction, and three circularopenings 101 d, 101 e, and 101 f are formed.

On the inner side of opening 101 b of plate member 101 and inside thehousing below opening 101 b (measurement table MTB), an illuminancemonitor (irradiation amount monitor) 122 is placed. The upper surface ofilluminance monitor 122 is coated with a liquid repellent material(water repellent material) such as a fluorine-based resin material or anacrylic-based resin material, and by this coating, a liquid repellentfilm is formed. In the present embodiment, the upper surface of thisliquid repellent film is set substantially in plane (flush) with theupper surface of plate member 101.

Illuminance monitor 122 in the present embodiment has a structuresimilar to the illuminance monitor (irradiation amount monitor) whosedetails are disclosed in, for example, U.S. Pat. No. 5,721,608 and thelike, and measures the illuminance of illumination light IL on the imageplane of projection optical system PL via liquid Lq.

Inside opening 101 a of plate member 101, as shown in FIG. 3, fiducialmark plate FM which is a rectangle in a planar view is placed. The uppersurface of fiducial mark plate FM is set substantially to the sameheight as (flush with) the surface of plate member 101. On the surfaceof fiducial mark plate FM, three pairs of a first fiducial mark RM₁₁ toRM₃₂ which can be simultaneously measured per pair by the pair ofreticle alignment detection systems RAa and RAb previously described,and three second fiducial marks WM₁ to WM₃ which are detected byalignment system ALG are formed in a predetermined positional relation.These fiducial marks are each formed of an opening pattern formed byperforming patterning in the predetermined positional relation describedabove on a chromium layer formed substantially on the entire surface ofa member structuring fiducial mark plate FM (for example, ultra lowexpansion glass-ceramics, such as, e.g., CLEARCERAM (registeredtrademark)). Incidentally, each fiducial mark can be formed of a pattern(remaining pattern) formed by aluminum and the like.

In the present embodiment, as disclosed in, for example, U.S. Pat. No.5,243,195 and the like, the placement of each fiducial mark describedabove is decided so that the first fiducial marks RM_(j1), RM_(j2) (j=1to 3) described above can be simultaneously measured by the pair ofreticle alignment detection systems RAa and RAb previously described vialiquid Lq, and also simultaneously with the measurement of the firstfiducial marks RM_(j1), RM_(j2), the second fiducial mark WM_(j) can bemeasured by alignment system ALG without going through liquid Lq. On theupper surface of fiducial mark plate FM, although it is not shown, aliquid repellent film, which is made of a liquid repellent material suchas the fluorine-based resin material, the acrylic-based resin materialor the like previously described, is formed on the upper part of thechromium layer previously described.

On the inner side of opening 101 d of plate member 101 and inside thehousing below opening 101 d, illuminance irregularity measuringinstrument 104 which has a pattern plate 103 that is circular in aplanar view is placed.

Illuminance irregularity measuring instrument 104 has pattern plate 103described above, and a sensor consisting of a photodetection elementwhich is not shown (such as a silicon photodiode or a photo multipliertube previously described) placed below the pattern plate. Pattern plate103 is made of quartz glass and the like, and has a light-shielding filmsuch as chromium formed on its surface, and in the center of thelight-shielding film, a pinhole 103 a is formed as a light transmittingsection. And, on the light-shielding film, a liquid repellent film madeof a liquid repellent material such as the fluorine-based resinmaterial, the acrylic-based resin material or the like previouslydescribed is formed.

Illuminance irregularity measuring instrument 104 has a structuresimilar to the illuminance irregularity measuring instrument disclosedin, for example, U.S. Pat. No. 4,465,368, and measures the illuminanceirregularity of illumination light IL on the image plane of projectionoptical system PL via liquid Lq.

Inside opening 101 e of plate member 101, a slit plate 105 which iscircular in a planar view is placed in a state so that its surface issubstantially in plane (flush) with the plate member 101 surface. Slitplate 105 has a quartz glass and a light-shielding film such as chromiumformed on the surface of the quartz glass, and slit patterns are formedextending in the X-axis direction and in the Y-axis direction atpredetermined places on the light-shielding film as a light transmittingsection. And, on the light-shielding film, a liquid repellent film madeof a liquid repellent material such as the fluorine-based resinmaterial, the acrylic-based resin material or the like previouslydescribed is formed. This slit plate 105 structures a part of an aerialimage measuring instrument which measures light intensity of an aerialimage (projection image) of a pattern projected by projection opticalsystem PL. In the present embodiment, inside measurement table MTB(housing) below this slit plate 105, a light receiving system isprovided which receives illumination light IL via the slit pattern whichis irradiated on plate member 101 via projection optical system PL andliquid Lq, and by this arrangement, an aerial image measuring instrumentsimilar to the one disclosed in, for example, U.S. Patent ApplicationPublication No. 2002/0041377 and the like, is structured.

Inside opening 101 f of plate member 101, a pattern plate 107 forwavefront aberration measurement which is circular in a planar view isplaced in a state so that its surface is substantially in plane (flush)with the plate member 101 surface. This pattern plate 107 for wavefrontaberration measurement has a quartz glass, and a light-shielding filmsuch as chromium formed on the surface of the quartz glass, and acircular opening is formed in the center of the light-shielding film.And, on the light-shielding film, a liquid repellent film made of aliquid repellent material such as the fluorine-based resin material, theacrylic-based resin material or the like previously described is formed.Inside measurement table MTB (housing) below this pattern plate 107 forwavefront aberration measurement, a light receiving system including,for example, a microlens array, is provided which receives illuminationlight IL via projection optical system PL and liquid Lq, and by thisarrangement, a wavefront aberration measuring instrument disclosed in,for example, European Patent No. 1,079,223 and the like is structured.

Incidentally, from the viewpoint of restraining thermal influence, forexample, only one portion such as the optical system may be mounted onmeasurement stage MST in the aerial image measuring instrument or thewavefront aberration measuring instrument described above.

Furthermore, in exposure apparatus 100 of the present embodiment,although it is not shown in FIG. 1, a multi-point focal point detectionsystem of an oblique incidence method similar to the one disclosed in,for example, U.S. Pat. No. 5,448,332 and the like which includes anirradiation system 110 a and a light receiving system 110 b (refer toFIG. 6) is provided.

In the present embodiment, as is shown in FIG. 4 which is a sectionalview of line A-A in FIG. 2, in the bottom section of wafer stage mainsection 91, a plurality of permanent magnets (hereinafter shortlyreferred to as magnets) 53 are placed in the shape of a matrix, andthese magnets 53 structure magnet unit 51A. Incidentally, while FIG. 4is a figure when viewed from the X-axis direction, the magnets areactually placed on the XY plane in the shape of a matrix. As theplurality of magnets 53, N-pole magnets whose side is a N-pole and −Zside is a S-pole and S-pole magnets having an opposite polarity areplaced alternately by a predetermined distance within the XY plane, andin between the N magnets and the S magnets, magnets are placed which aremagnetized in the X-axis direction and in the Y-axis direction so thatmagnetic poles on the side facing the N-pole magnet are N and magneticpoles on the side facing the S-pole magnet are S, and by thisarrangement, magnet unit 51A is structured. Further, in the bottomsection of measurement stage main section 92, the plurality of magnets53 are placed similarly to magnet unit 51A, and by such plurality ofmagnets, magnet unit 51B is structured. Incidentally, FIG. 4 is a viewused to explain a positional relation between coils 38 of coil unit 60and magnet units 51A and 51B, and in FIG. 4, the placement of themagnets of magnet units 51A and 51B is simplified and is different fromthe actual placement. The same can be said for the placement of coils 38of coil unit 60.

Stage base 21, as shown in FIG. 2, is equipped with a hollow mainsection 35 whose upper surface is open, and a ceramic plate 36 (refer toFIG. 4) which blocks the opening section of main section 35.

In an inner space of stage base 21 formed by main section 35 and ceramicplate 36, a large number of armature coils (hereinafter shortly referredto as coils) 38 are placed in an XY two-dimensional direction, in theshape of a matrix (refer to FIG. 2). By these coils 38, a coil unit isstructured which is stator 60 of a magnetic levitation type planar motoremploying a moving magnet type electromagnetic driving method(hereinafter also appropriately referred to as coil unit 60) thatstructure each of wafer stage driving system 50A and measurement stagedriving system 50B (hereinafter appropriately described as planar motors50A and 50B). As each of the large number of coils 38, as shown in FIG.2, a square shaped coil is used. The magnitude and direction of theelectric current supplied to each of the large number of coils 38structuring stator 60 are controlled by main controller 20 (refer toFIG. 6). Further, while the plurality of magnets (N-pole magnets andS-pole magnets) placed in the shape of a matrix are alternately placedin a predetermined distance as is previously described, thepredetermined distance (magnetic pole pitch), and the size of theplurality of coils and the distance between adjacent coils are to be setin advance in a predetermined relation as specification values of themotor (planar motor). Furthermore, in the present embodiment, in a partof armature coils 38, the electric current for X thrust and the electriccurrent for Z thrust are supplied in a superimposing manner as disclosedin, for example, U.S. Pat. No. 6,304,320, and armature coils 38 whoseelectric current is supplied in such a manner perform electromagneticinteraction with a part of magnets 53 that structure each of magnetunits 51A and 51B so as to generate a driving force (thrust) in theX-axis direction and in the Z-axis direction. Further, in the presentembodiment, in a part of coils 38, the electric current for Y thrust andthe electric current for Z thrust are supplied in a superimposingmanner, and coils 38 whose electric current is supplied in such a mannerperform electromagnetic interaction with a part of magnets thatstructure each of magnet units 51A and 51B so as to generate a drivingforce (thrust) in the Y-axis direction and in the Z-axis direction. Thatis, in the present embodiment, by planar motor 50A, wafer stage WST canbe driven in directions of six degrees of freedom (in each of theX-axis, the Y-axis, the Z-axis, the θx, the θy, and the θz directions).In this case, by planar motor 50A, wafer stage WST is driven in longstrokes in the X-axis direction and the Y-axis direction, and is drivenfinely in the remaining directions of four degrees of freedom. Further,by planar motor 50B, measurement stage MST can be driven in directionsof six degrees of freedom similarly to wafer stage WST. In the presentembodiment, planar motor 50A structuring wafer stage driving system andplanar motor 50B structuring measurement stage driving system structurestage driving system 124 (refer to FIG. 5).

FIG. 5 shows a bottom surface view of wafer stage WST and measurementstage MST. As shown in FIG. 5, in the bottom section of wafer stage mainsection 91 of wafer stage WST, magnet unit 51A is placed covering almostthe entire surface. Meanwhile, in the bottom section of measurementstage main section 92 of measurement stage MST, magnet unit 51B isplaced in a remaining area which is an area excluding the edge on the +Yside. In this case, the distance between magnet unit 51A and magnet unit51B is indicated as Lm, as shown in FIG. 4, in a state where wafer stageWST and measurement stage MST are in proximity with each other by apredetermined distance, e.g., within 300 μm, or are in contact in theY-axis direction, and in between this distance Lm and a length Lc in theY-axis direction of coils 38, a relation Lm≧Lc is valid. That is, in theY-axis direction, the total of distance (D1), which is from an end onone side (minus Y side) of wafer stage WST to an end on one side ofmagnet unit 51A, and distance (D2), which is from an end on the otherside (plus Y side) of measurement stage MST to an end on the other sideof magnet unit 51B, is at least equal to or longer than the length ofone coil 38 in the Y-axis direction. Namely, in the present embodiment,to make the relation Lm≧(D1+D2) Lc effective, or in other words, to makesure that magnet 53 structuring magnet unit 51A and magnet 53structuring magnet unit 51B do not simultaneously face the same coil 38structuring coil unit 60 in a state where wafer stage WST andmeasurement stage MST are positioned within a predetermined range (arange facing stator 60) above stage base 21, and also are in proximityby a predetermined distance (e.g., within 300 μm) or in contact witheach other in the Y-axis direction, a placement of a plurality ofmagnets in the periphery of magnet unit 51A on wafer stage WST and aplacement of a plurality of magnets in the periphery of magnet unit 51Bon measurement stage MST are decided according to the size and theplacement of coils 38 of coil unit 60. Incidentally, while Lm is setequal to or more than coil length Lc at least in the Y-axis direction,more preferably, Lm can be set shorter than the length of two coils sothat the relation of, for example, 2Lc≧Lm≧(D1+D2)≧Lc becomes valid. Or,Lm can be shorter than one and a half of the coil, so that1.5Lc≧Lm≧(D1+D2)≧Lc. Further, distance Lm can be set, based on themagnetic pole pitch of magnet unit 51A (or magnet unit 51B). Forexample, distance Lm can be set to be equal to or more than two magneticpole pitches.

FIG. 6 shows a block diagram of an input-output relation of maincontroller 20 which mainly structures a control system of exposureapparatus 100 that has overall control of each part. Main controller 20includes a so-called workstation (or a microcomputer) and the like, andhas overall control of each section of exposure apparatus 100. In FIG.6, reference sign 143 indicates a group of measuring instrumentspreviously described, such as illuminance monitor 122, illuminanceirregularity measuring instrument 104, aerial image measuringinstrument, wavefront aberration measuring instrument and the likeprovided on measurement table MTB.

Next, a concurrent processing operation using wafer stage WST andmeasurement stage MST in exposure apparatus 100 related to the presentembodiment will be described, based on FIG. 7 and the like.Incidentally, during the operation below, by controlling liquidimmersion device 132 so that a predetermined amount of liquid Lq issupplied from liquid supply nozzle 131A and a predetermined amount ofliquid Lq is recovered from liquid recovery nozzle 131B, main controller20 continues to fill in an optical path space on the image plane side ofprojection optical system PL with liquid Lq.

FIG. 7 shows a state where exposure by a step-and-scan method isperformed on wafer W (here, as an example, the last wafer of a lot (25or 50 wafers per lot)) on wafer stage WST. At this point, measurementstage MST is actually waiting at a predetermined waiting position whereit does not collide with wafer stage WST.

The exposure operation described above is performed by main controller20, by repeating a movement operation between shots where wafer stageWST is moved to a scanning starting position (acceleration startingposition) for exposing each shot area on wafer W and a scanning exposureoperation where the pattern formed on reticle R is transferred by thescanning exposure method onto each shot area, based on results of waferalignment and the like performed beforehand, for example, such asEnhanced Global Alignment (EGA). Incidentally, the exposure operationdescribed above is performed in a state where liquid Lq is held in thespace between tip lens 191 and wafer W.

Then, at the stage when exposure to wafer W has been completed on thewafer stage WST side, main controller 20 controls planar motor 50B ofstage driving system 124 based on the measurement values ofinterferometer system 118, and as shown in FIG. 2, moves measurementstage MST (measurement table MTB) to a position in proximity with the −Yside of wafer stage WST which is at an exposure finishing position. Atthis point, of interferometer system 118, main controller 20 monitorsmeasurement values of an interferometer which measures the position inthe Y-axis direction of each table, and maintains a non-contact state bysetting measurement table MTB and wafer table WTB apart in the Y-axisdirection, for example, by around 300 μm. Incidentally, the arrangementis not limited to this, and main controller 20 can make the −Y sidesurface of measurement table MTB be in contact with the +Y side surfaceof wafer table WTB.

Next, main controller 20 begins an operation of simultaneously drivingboth stages WST and MST in the +Y direction, while maintaining thepositional relation of wafer table WTB and measurement table MTB in theY-axis direction.

When wafer stage WST and measurement stage MST are simultaneously movedin the manner described above by main controller 20, accompanying thismovement of wafer stage WST and measurement stage MST in the +Ydirection, liquid Lq held in the space between tip lens 191 ofprojection unit PU and wafer W sequentially moves from the area on waferW to plate 93 (wafer table WTB) to measurement table MTB. That is,liquid Lq moves to a state where it is held in the space betweenmeasurement table MTB and tip lens 191.

Here, in the present embodiment, as it can be seen from FIG. 4, a partof magnets 53 structuring magnet unit 51A and a part of magnets 53structuring magnet unit 51B are kept from simultaneously facing any ofthe coils 38 when liquid Lq (liquid immersion area 14) is delivered fromthe area on wafer table WTB to the area on measurement table MTB in themanner described above. Accordingly, in the present embodiment, maincontroller 20 allows the delivery of liquid Lq (liquid immersion area14) from the area on wafer table WTB to the area on measurement tableMTB to be performed, by moving wafer stage WST and measurement stage MSTin the +Y direction while maintaining the proximity or the contact statewith each other in the Y-axis direction, via each of the planar motors50A and 50B. In this case, because the magnetic field generated by thesame coil 38 does not act simultaneously on magnet unit 51A and magnetunit 51B, wafer stage WST and measurement stage MST can be driven in astable manner, which keeps both stages from colliding, or keeps liquidLq from leaking through a gap in the case the gap between both stagesbecome partly wide.

When the delivery of liquid Lq (liquid immersion area 14) from the areaon wafer table WTB to the area on measurement table MTB described aboveis completed, main controller 20 moves wafer stage WST to apredetermined wafer exchange position while controlling the position ofwafer stage WST by planar motor 50A based on the measurement values ofinterferometer system 118, and also performs wafer exchange of the waferto a first wafer of the following lot, and concurrently with thisoperation, executes predetermined measurements using measurement stageMST as necessary.

As a predetermined measurement described above, for example, base linemeasurement of alignment system ALG can be given. To be more specific,main controller 20 simultaneously detects the pair of the first fiducialmarks on fiducial mark plate FM provided on measurement table MTB andthe corresponding pair of reticle alignment marks on reticle R usingreticle alignment detection systems RAa and RAb previously described,and detects a positional relation between the pair of the first fiducialmarks and the corresponding reticle alignment marks. At this point, thefirst fiducial marks are detected via projection optical system PL andliquid Lq. Further, simultaneously with this, main controller 20 detectsa positional relation between the detection center of alignment systemALG and the second fiducial mark, by detecting the second fiducial markon fiducial mark plate FM described above with alignment system ALG.

Then, main controller 20 obtains a distance (or a positional relation)between the projection center of the reticle pattern and the detectioncenter of alignment system ALG by projection optical system PL, that is,the base line of alignment system ALG, based on the positional relationbetween the pair of the first fiducial marks and the correspondingreticle alignment marks and the positional relation between thedetection center of alignment system. ALG and the second fiducial markdescribed above, and a known positional relation between the pair of thefirst fiducial marks and the second fiducial mark.

Then, at the stage when the operations on both stages WST and MSTdescribed above have been completed, main controller 20 sets measurementstage MST and wafer stage WST to the proximity or the contact statepreviously described, and moves wafer stage WST (wafer) to a positionbelow projection optical system PL by driving both stages WST and MST inthe −Y direction opposite to the earlier description while holdingliquid Lq below projection optical system FL and maintaining thepositional relation in the Y-axis direction of wafer stage WST andmeasurement stage MST. Here, also on the delivery of liquid Lq (liquidimmersion area 14) from the area on measurement table MTB to the area onwafer table WTB, a part of magnets 53 structuring magnet unit 51A and apart of magnets 53 structuring magnet unit 51B are kept fromsimultaneously facing any of the coils 38. Accordingly, in the presentembodiment, main controller 20 allows the delivery of liquid Lq (liquidimmersion area 14) from the area on measurement table MTB to the area onwafer table WTB, by moving wafer stage WST and measurement stage MST inthe −Y direction while maintaining the proximity or the contact statewith each other in the Y-axis direction, via each of the planar motors50A and 50B. In this case as well, for the same reasons as is previouslydescribed, wafer stage WST and measurement stage MST can be driven in astable manner, which keeps both stages from colliding, or keeps liquidLq from leaking through a gap in the case the gap between both stagesbecome partly wide.

When moving wafer stage WST (wafer) to the area below projection opticalsystem PL is completed, main controller 20 withdraws measurement stageMST to a predetermined position.

Then, main controller 20 executes wafer alignment and exposure operationby the step-and-scan method to a new wafer, and sequentially transfersthe reticle pattern onto the plurality of shot areas on wafer.Hereinafter, a similar operation is repeatedly performed.

As is described so far, according to exposure apparatus 100 of thepresent embodiment, stage device 150 is equipped with wafer stage WSTand measurement stage MST which can move independently to each otherabove stage base 21 in directions of six degrees of freedom, and withplanar motors 50A and 50B (stage driving system 124) that are providedin wafer stage WST and measurement stage MST, respectively, havingmagnet units 51A and 51B that each include the plurality of magnets 53and coil unit 60 including the plurality of coils 38 arrangedtwo-dimensionally in stage base 21 that drive wafer stage WST andmeasurement stage MST by a driving force generated y the electromagneticinteraction between magnet unit 51A and 51B. Further, in a state wherewafer stage WST and measurement stage MST are positioned within apredetermined range above stage base 21, and also in proximity within apredetermined distance from each other or in contact in the Y-axisdirection, the placement on wafer stage WST or on measurement stage MSTof the plurality of magnets in the periphery of magnet units 51A and 51Bis decided, according to the size and placement of coils 38 of coil unit60 so that the magnets structuring magnet unit 51A and the magnetsstructuring magnet unit 515 do not simultaneously face the same coil 38structuring coil unit 60. Accordingly, main controller 20 can drivewafer stage WST and measurement stage MST in a stable mannerindependently from each other within the XY plane.

Further, according to exposure apparatus 100 of the present embodiment,on the delivery of liquid Lq (liquid immersion area 14) between wafertable WTB and measurement table MTB previously described, maincontroller 20 can drive wafer stage WST and measurement stage MST in astable manner independently from each other within the XY plane. To bemore specific, on the delivery of liquid Lq (liquid immersion area 14)as well, main controller 20 can independently drive wafer stage WST andmeasurement stage MST in the Y-axis direction, while maintaining theproximity or the contact state in the Y-axis direction. Accordingly, thegap distance between wafer stage WST and measurement stage MST can beconstantly maintained, which keeps both stages WST and MST fromcolliding, and keeps the liquid from leaking through the gap betweenboth stages. Therefore, according to exposure apparatus 100, abnormalityoccurring such as collision of both stages WST and MST and leakage ofthe liquid, or furthermore, a decrease in productivity due to shutdownof the apparatus caused by such abnormality occurring can be effectivelysuppressed.

Further, in exposure apparatus 100 related to the present embodiment, byperforming exposure with high resolution and also with a larger depth offocus than in air by the liquid immersion exposure, the pattern ofreticle R can be transferred on the wafer with good accuracy, and forexample, transfer of a fine pattern having a device rule of around 45 to100 nm with an ArF excimer laser beam can be achieved.

Incidentally, in the embodiment described above, the case has beendescribed where coil unit 60 is structured using the square shaped coils38 arranged two-dimensionally in the XY directions, and magnet units 51Aand 518 consisting of a plurality of magnets placed in a square areacorresponding to this are used. However, the present invention is notlimited to this, and for example, as in wafer stages WST′ and MST′ whosebottom surface views are each shown in FIG. 8, a layout can be employedin which in an area where one end and the other end in the Y-axisdirection of the bottom surface of wafer stage main section 91 andmeasurement stage main section 92 are uneven, magnets of magnet units51A and 51B are placed. In the stage device equipped with wafer stagesWST′ and MST′ related to the modified example in FIG. 8 and the liquidimmersion exposure apparatus equipped with the stage device, in apositional relation shown in FIG. 8, that is, in a state where stageWST′ and measurement stage MST′ are positioned within a predeterminedrange above stage base 21, and are in a proximity or a contact statewith each other within a predetermined distance in the Y-axis directionand also in a predetermined positional relation with each other in theX-axis direction as shown in FIG. 8, placement of the plurality ofmagnets in the periphery of each of the magnet units 51A and 51B onwafer stage WST′ and measurement stage MST′ is decided, according to thesize and placement of coils 38 of coil unit 60 so that the magnetsstructuring magnet unit 51A and the magnets structuring magnet unit 51Bdo not simultaneously face the same coil 38 structuring coil unit 60.Accordingly, main controller 20 can independently drive wafer stage WST′and measurement stage MST′ shown in FIG. 8, and while maintaining thepositional relation of both stages, by driving wafer stage WST andmeasurement stage MST in the +Y direction or in the −Y direction andperforming delivery of liquid Lq previously described between bothstages, abnormality occurring such as collision of both stages WST andMST and leakage of the liquid, or furthermore, a decrease inproductivity due to shutdown of the apparatus caused by such abnormalityoccurring can be effectively suppressed.

Incidentally, in the embodiment described above, while wafer stage WSTand measurement stage MST are made independently drivable by keeping Ydriving magnets structuring magnet unit 51A and Y driving magnetsstructuring magnet unit 51B from simultaneously facing the same Y-axisdirection driving coil structuring coil unit 60, the present inventionis not limited to this.

For example, the placement of the plurality of magnets (especially the Ydriving magnets) in the periphery of each of the magnet units 51A and51B on wafer stage WST and measurement stage MST can be decided,according to the size and placement of the coils of coil unit 60 so thatan electromagnetic interaction occurs between a magnetic field generatedby a predetermined coil structuring coil unit 60 and a magnetstructuring magnet unit 51A while an electromagnetic interaction doesnot occur between the magnetic field generated by the predetermined coiland a magnet structuring magnet unit 51B. In this case, electromagneticinteraction does not occur, includes the case where the magnetic fieldgenerated by the predetermined coil does not reach the magnetstructuring magnet unit 51B and no electromagnetic interaction occurs,as well as the case where an electromagnetic interaction occurs and adriving force is generated but in a state where the driving forcegenerated is sufficiently small so that wafer stage WST and measurementstage MST can be controlled independently with each other.

Incidentally, in the embodiment described above, while the case has beendescribed of an exposure apparatus equipped with measurement stage MSTseparate from wafer stage WST, the present invention is not limited tothis, and the embodiment described above can also be applied to amulti-stage type exposure apparatus equipped with a plurality of waferstages holding the wafer like the ones disclosed in, for example, U.SPatent Application Publication No. 2011/0025998, and U.S. Pat. No.5,969,441 and the like. In this case, for example, as in the modifiedexample shown in FIG. 9, on the upper part of wafer stage main section91 structuring each of the two wafer stages WST1 and WST2, wafer tablesWTB having a pair of protruding portions that protrude by Lm/2 or morefrom both side surfaces in the Y-axis direction of wafer stage mainsection 91 can be mounted. In this case, magnet units can be placed onthe entire bottom surface of wafer stage main section 91. Furthermore,in this case, the pair of protruding portions whose length in the Y-axisdirection is Lm or more can be provided only in one of the wafer tablesWTB, or the pair of protruding portions whose length in the Y-axisdirection is Lm or more can be provided on only one side in the Y-axisdirection of both wafer tables WTB. The point is, the two wafer tablesWTB should be in a state in proximity within a predetermined distance orin contact in the Y-axis direction, with the distance in the Y-axisdirection in between the wafer stage main sections 91 equipped in thetwo wafer stages WST being Lm or more. As a matter of course, instead ofproviding the protruding portions, wafer stage main section 91 and wafertable WTB can have an identical shape in a planar view, and the layoutof the magnet units on the bottom surface of the two wafer stage mainsections 91 can be set so that the distance in the Y-axis directionbetween the magnet units becomes Lm or more in a state where the twowafer stages WST are in proximity within a predetermined distance or incontact in the Y-axis direction. The same can be said for thecombination of wafer stage WST and measurement stage MST of theembodiment previously described.

Incidentally, in the embodiment described above, while the case has beendescribed where a large fiducial mark plate FM that can simultaneouslyperform reticle alignment and base line measurement of the alignmentsystem is provided on measurement stage, the present invention is notlimited to this, and a small fiducial mark plate can be provided onwafer stage WST that requires relative movement of the fiducial markplate with respect to projection optical system and the alignment systemat the time of reticle alignment and at the time of base linemeasurement.

Incidentally, instead of the square shaped coils, as disclosed in, forexample, U.S. Pat. No. 6,445,093 and the like, a planar motor device isalso known that has rectangular shaped coils or hexagonal shaped coilsplaced two-dimensionally with the coils serving as X driving coils and Ydriving coils, respectively, and corresponding to these coils, X drivingmagnets and Y driving magnets are used. The embodiment described abovecan also be applied to the stage device and the exposure apparatusequipped with such a planar motor device. In this case, the placement ofthe plurality of magnets (especially the Y driving magnets) in theperiphery of each of the magnet units 51A and 51B on wafer stage WST andmeasurement stage MST can be decided, according to the size andplacement of the coils of coil unit 60 so that not all the magnets but Ydriving magnets structuring magnet unit 51A and Y driving magnetsstructuring magnet unit 51B do not simultaneously face the same Y-axisdirection driving coil structuring coil unit 60, in a state where waferstage WST (a first movable body) and measurement stage MST (a secondmovable body) are positioned within a predetermined range above stagebase 21, in a state in proximity with each other within a predetermineddistance or are in contact in the Y-axis direction and are also in astate at least in a predetermined positional relation in the X-axisdirection.

Further, in the embodiment described above, while the case has beendescribed where stage device 150 is equipped with a magnetic levitationtype planar motor, the present invention is not limited to this, and thestage device (movable body apparatus) can be equipped with an airlevitation type planar motor. In this case, a gas static bearing such asan air bearing, which supports wafer stage WST and measurement stage MSTin a non-contact manner on the upper surface of stage base 21 serving asa guide surface when wafer stage WST and measurement stage MST move, isprovided on each of the bottom surfaces of wafer stage WST andmeasurement stage MST.

Further, in the embodiment described above, while the case has beendescribed where wafer stage WST and measurement stage MST are both asingle stage that can be driven in directions of six degrees of freedom,the present invention is not limited to this, and the stages can be aso-called coarse movement stage consisting of a coarse movement stageand a fine movement stage. In this case, the placement of magnets of amagnet unit provided in the coarse movement stage only has to satisfythe conditions previously described.

Incidentally, in the embodiment described above, while one each of theliquid supply nozzle and the liquid recovery nozzle are provided, thepresent invention is not limited to this, and as disclosed in, forexample, PCT International Publication No. 99/49504, a structure havingmultiple nozzles can be employed. Further, the structure disclosed in,European Patent Application Publication No. 1,598,855 and the like canbe employed for liquid immersion device 132. The point is, the structureof liquid immersion device 132 can be of any form, as long as liquid canbe supplied to the space between the lowermost optical member (tip lens)191 structuring projection optical system PL and wafer W. Further, theembodiment and the modified example described above can be applied notonly to a liquid immersion exposure apparatus, but also to a typical dryexposure type exposure apparatus which does not use liquid.

Incidentally, in the embodiment described above, while the case has beendescribed where the exposure apparatus is a scanning exposure apparatusof a step-and-scan method and the like, the present invention is notlimited to this, and the exposure apparatus can be a projection exposureapparatus of a step-and-repeat method, or furthermore, an exposureapparatus of a step-and-stitch method, or an exposure apparatus of aproximity method.

Incidentally, in the embodiment described above, while the case has beendescribed where the position of wafer stage WST and measurement stageMST is measured using the interferometer system, instead of theinterferometer system, or along with the interferometer system, anencoder system can be used. As the encoder system in this case, anencoder system can be employed in which a scale is provided on the wafertable or the measurement table, and facing the scale, an encoder headsection is placed external to wafer table WTB or measurement table MTB,as disclosed in, for example, U.S. Patent Application Publication No.2008/0088843 and the like, or an encoder system having a structure of aplurality of encoder head sections being provided on wafer table WTB andmeasurement table MTB, and facing these sections, a grating section (forexample, a two-dimensional grating or a linear grating section placedtwo-dimensionally) is placed external to wafer table WTB and measurementtable MTB, can also be employed, as disclosed in, for example, U.S.Patent Application Publication No. 2006/0227309 and the like.

Further, the projection optical system of the exposure apparatus in theembodiment described above is not limited to the reduction system, andcan either be an equal magnifying or a magnifying system, and projectionoptical system PL is not limited to the refractive system, and can alsoeither be a reflection system and catodioptric system, and theprojection image can either be an inverted image or an upright image.

Incidentally, the light source of the exposure apparatus in theembodiment described above is not limited to the ArF excimer laser, anda pulse laser light source such as a KrF excimer laser (outputwavelength 248 nm), an F₂ laser (output wavelength 157 nm), an Ar₂ laser(output wavelength 126 nm), a Kr₂ laser (output wavelength 146 nm) andthe like, or a super high pressure mercury lamp which emits a g-line(wavelength 436 nm), an i-line (wavelength 365 nm) and the like can alsobe used. Further, a harmonic generator of a YAG laser and the like canalso be used. Besides this, a harmonic wave, which is obtained byamplifying a single-wavelength laser beam in the infrared or visiblerange emitted by a DFB semiconductor laser or fiber laser as vacuumultraviolet light, with a fiber amplifier doped with, for example,erbium (or both erbium and ytterbium), and by converting the wavelengthinto ultraviolet light using a nonlinear optical crystal, can also beused. Further, the projection optical system is not limited to thereduction system, and can either be an equal magnifying or a magnifyingsystem.

Incidentally, in the embodiment described above, while a lighttransmissive type mask in which a predetermined light-shielding pattern(or a phase pattern or a light-attenuation pattern) is formed on a lighttransmitting substrate is used, instead of this mask, an electron maskon which a light-transmitting pattern, a reflection pattern, or anemission pattern is formed according to electronic data of the patternthat is to be exposed can also be used, as disclosed in, for example,U.S. Pat. No. 6,778,257.

Further, as disclosed in, PCT International Publication No. 2001/035168and the like, the embodiment described above can also be applied to anexposure apparatus (lithography system) which forms a line-and-spacepattern on wafer W by forming an interference fringe on wafer W.

Furthermore, as disclosed in, for example, U.S. Pat. No. 6,611,316, theembodiment described above can also be applied to an exposure apparatusthat synthesizes two reticle patterns on a wafer via a projectionoptical system, and by performing scanning exposure once, performsdouble exposure of one shot area on the wafer almost simultaneously.

Incidentally, in the embodiment described above, the object (the objectsubject to exposure on which an energy beam is irradiated) on which thepattern is to be formed is not limited to a wafer, and may be anotherobject such as a glass plate, a ceramic substrate, a film member, or amask blank and the like.

The usage of the exposure apparatus is not limited to the exposureapparatus used for producing semiconductors, and for example, and canalso be widely applied to an exposure apparatus for liquid crystals usedto transfer a liquid crystal display device pattern on a square shapedglass plate, or an exposure apparatus used to manufacture an organic EL,a thin film magnetic head, an imaging device (such as a CCD), amicromachine, a DNA chip and the like. Further, the embodiment describedabove can also be applied not only to an exposure apparatus forproducing microdevices such as semiconductor devices, but also to anexposure apparatus which transfers a pattern on a glass substrate or asilicon wafer, in order to manufacture a reticle or a mask used in alight exposure apparatus, an EUV exposure apparatus, an X-ray exposureapparatus, and an electron beam exposure apparatus and the like.

Incidentally, semiconductor devices are manufactured through thefollowing steps; a step of performing function/performance design of thedevice, a step of manufacturing a reticle based on the design, a step ofmanufacturing a wafer from silicon materials, a lithography step oftransferring the pattern formed on the reticle onto an object such asthe wafer with the exposure apparatus in the embodiment described aboveby the liquid immersion exposure previously described, a device assemblystep (including a dicing process, a bonding process, and a packageprocess), an inspection step and the like. In this case, in thelithography step, because the device pattern is formed on the object byexecuting the liquid immersion exposure method previously describedusing the exposure apparatus of the embodiment described above, highlyintegrated devices can be produced with good yield.

Incidentally, the disclosures of the PCT International Publications, theU.S. patent application Publications and the U.S. patents that are citedin the description so far related to exposure apparatuses and the likeare each incorporated herein by reference.

While the above-described embodiment of the present invention is thepresently preferred embodiment thereof, those skilled in the art oflithography systems will readily recognize that numerous additions,modifications, and substitutions may be made to the above-describedembodiment without departing from the spirit and scope thereof. It isintended that all such additions, modifications, and substitutions fallwithin the scope of the present invention, which is best defined by theclaims appended below.

What is claimed is:
 1. A movable body apparatus, comprising: a firstmovable body which can move along a two-dimensional plane above a stagebase; a second movable body which can move along the two-dimensionalplane independently from the first movable body above the stage base;and a planar motor which has a first magnet unit including a pluralityof magnets provided in the first movable body, a second magnet unitincluding a plurality of magnets provided in the second movable body,and a coil unit including a plurality of coils arrangedtwo-dimensionally above the stage base, and drives the first movablebody by a driving force generated by an electromagnetic interactionbetween the first magnet unit and the coil unit and drives the secondmovable body by a driving force generated by an electromagneticinteraction between the second magnet unit and the coil unit, wherein aplacement of the plurality of magnets in the periphery of each of thefirst magnet unit and the second magnet unit on the first movable bodyor the second movable body is decided according to a size and aplacement of coils of the coil unit, so that no magnets structuring thefirst magnet unit and no magnets structuring the second magnet unitsimultaneously face the same first direction driving coil structuringthe coil unit, in a state where the first movable body and the secondmovable body are in a first state of being positioned within apredetermined range above the stage base and in proximity within apredetermined distance or in contact with each other in a firstdirection parallel to the two-dimensional plane, and also in a statewhere the first movable body and the second movable body are at least ina predetermined positional relation in a second direction orthogonal tothe first direction within the two-dimensional plane.
 2. The movablebody apparatus according to claim 1 wherein a placement of the pluralityof magnets in the periphery of each of the first magnet unit and thesecond magnet unit on the first movable body or the second movable bodyis decided according to a size and a placement of coils of the coilunit, so that no magnets structuring the first magnet unit and nomagnets structuring the second magnet unit simultaneously face the samefirst direction driving coil structuring the coil unit, regardless of apositional relation in the second direction between the first movablebody and the second movable body when the first movable body and thesecond movable body are in the first state.
 3. An exposure apparatuswhich exposes an object with an energy beam via an optical system andliquid, the apparatus comprising: a movable body apparatus according toclaim 1 wherein the object is mounted on the first movable body or thesecond movable body, or on the first movable body and the second movablebody; and a liquid immersion device which supplies liquid to an areadirectly below the optical system and forms a liquid immersion areabetween the optical system and the first movable body or the secondmovable body, or the optical system and the first movable body and thesecond movable body, wherein delivery of the liquid immersion area isperformed between the first movable body and the second movable bodywhen the first movable body and the second movable body are in the firststate.
 4. The exposure apparatus according to claim 3 wherein the firstmovable body is an object stage on which the object is mounted, and thesecond movable body is a measurement stage on which a measurement memberis provided.
 5. The exposure apparatus according to claim 4 wherein inthe object stage, the first magnet unit is placed substantially on anentire surface which is a surface on a side facing the stage base, andin the measurement stage, the second magnet unit is placed in an area ofa surface on a side facing the stage base, the area excluding a portionon one end in the first direction which is on a side that can be inproximity with the object stage.
 6. The exposure apparatus according toclaim 3 wherein the first movable body and the second movable body areboth an object stage on which the object is mounted.
 7. The exposureapparatus according to claim 6 wherein in the first movable body and thesecond movable body, a protruding portion which protrudes outwardly atleast to one side in the first direction is provided in each of theupper end portions of the first movable body and the second movablebody, and a protruding dimension of the protruding portion in the firstdirection is decided according to a dimension of the first directiondriving coil in the first direction.
 8. The exposure apparatus accordingto claim 3 wherein exposure of the object is performed by scanning theobject mounted on the first movable body or the second movable body inthe first direction with respect to the energy beam via the opticalsystem.
 9. A device manufacturing method, including: exposing asensitive object using the exposure apparatus according to claim 3; anddeveloping the object which has been exposed.
 10. A movable bodyapparatus, comprising: a first movable body which can move along atwo-dimensional plane above a stage base; a second movable body whichcan move along the two-dimensional plane independently from the firstmovable body above the stage base; and a planar motor which has a firstmagnet unit including a plurality of magnets provided in the firstmovable body, a second magnet unit including a plurality of magnetsprovided in the second movable body, and a coil unit including aplurality of coils arranged two-dimensionally above the stage base, anddrives the first movable body by a driving force generated by anelectromagnetic interaction between the first magnet unit and the coilunit and the second movable body by a driving force generated by anelectromagnetic interaction between the second magnet unit and the coilunit, wherein a placement of the plurality of magnets in the peripheryof each of the first magnet unit and the second magnet unit on the firstmovable body or the second movable body is decided according to a sizeand a placement of coils of the coil unit, so that an electromagneticinteraction occurs between a magnetic field generated by a predeterminedcoil structuring the coil unit and magnets structuring the first magnetunit, and an electromagnetic interaction does not occur between themagnetic field generated by the predetermined coil and magnetsstructuring the second magnet unit, in a state where the first movablebody and the second movable body are in a first state of beingpositioned within a predetermined range above the stage base and inproximity within a predetermined distance or in contact with each otherin a first direction parallel to the two-dimensional plane, and also ina state where the first movable body and the second movable body are atleast in a predetermined positional relation in a second directionorthogonal to the first direction within the two-dimensional plane. 11.An exposure apparatus which exposes an object with an energy beam via anoptical system and liquid, the apparatus comprising: a movable bodyapparatus according to claim 10 wherein the object is mounted on thefirst movable body or the second movable body, or on the first movablebody and the second movable body; and a liquid immersion device whichsupplies liquid to an area directly below the optical system and forms aliquid immersion area between the optical system and the first movablebody or the second movable body, or the optical system and the firstmovable body and the second movable body, wherein delivery of the liquidimmersion area is performed between the first movable body and thesecond movable body when the first movable body and the second movablebody are in the first state.
 12. The exposure apparatus according toclaim 11 wherein the first movable body is an object stage on which theobject is mounted, and the second movable body is a measurement stage onwhich a measurement member is provided.
 13. The exposure apparatusaccording to claim 12 wherein in the object stage, the first magnet unitis placed substantially on an entire surface which is a surface on aside facing the stage base, and in the measurement stage, the secondmagnet unit is placed in an area of a surface on a side facing the stagebase, the area excluding a portion on one end in the first directionwhich is on a side that can be in proximity with the object stage. 14.The exposure apparatus according to claim 11 wherein the first movablebody and the second movable body are both an object stage on which theobject is mounted.
 15. The exposure apparatus according to claim 14wherein in the first movable body and the second movable body, aprotruding portion which protrudes outwardly at least to one side in thefirst direction is provided in each of the upper end portions of thefirst movable body and the second movable body, and a protrudingdimension of the protruding portion in the first direction is decidedaccording to a dimension of the first direction driving coil in thefirst direction.
 16. The exposure apparatus according to claim 11wherein exposure of the object is performed by scanning the objectmounted on the first movable body or the second movable body in thefirst direction with respect to the energy beam via the optical system.17. A device manufacturing method, including: exposing a sensitiveobject using the exposure apparatus according to claim 11; anddeveloping the object which has been exposed.
 18. A movable bodyapparatus, comprising: a first movable body which can move along atwo-dimensional plane above a stage base; a second movable body whichcan move along the two-dimensional plane independently from the firstmovable body above the stage base; and a planar motor which has a firstmagnet unit including a plurality of magnets provided in the firstmovable body, a second magnet unit including a plurality of magnetsprovided in the second movable body, and a coil unit including aplurality of coils arranged two-dimensionally above the stage base, anddrives the first movable body by a driving force generated by anelectromagnetic interaction between the first magnet unit and the coilunit and the second movable body by a driving force generated by anelectromagnetic interaction between the second magnet unit and the coilunit, wherein a total of a distance from an end on one side of the firstmovable body to an end on one side of the first magnet unit and adistance from the end on the other side of the second movable body to anend on the other side of the second magnet unit, in a first directionparallel to the two-dimensional plane, includes a length which is atleast one coil length in the first direction.
 19. The movable bodyapparatus according to claim 18 wherein when a distance from the end onone side of the first movable body to the end of one side of the firstmagnet unit in the first axis direction is expressed as D1, a distancefrom the end on the other side of the second movable body to the end onthe other side of the second magnet unit in the first axis direction isexpressed as D2, and a length of the one coil in the first direction isexpressed as Lc, a relation (D1+D2)≧Lc is defined, in a state where thefirst movable body and the second movable body are positioned within apredetermined range above the stage base, in a first state where the endon the one side of the first movable body and the end on the other sideof the second movable body are in proximity within a predetermineddistance or in contact with each other in the first direction and atleast in a predetermined positional relation in a second directionorthogonal to the first direction within the two-dimensional plane. 20.The movable body apparatus according to claim 18 wherein when a spacingbetween the first magnet unit and the second magnet unit in the firstdirection is expressed as Lm, and a length of the one coil in the firstdirection is expressed as Lc, a relation Lm≧Lc is defined, in a statewhere the first movable body and the second movable body are positionedwithin a predetermined range above the stage base, in a first statewhere the end on the one side of the first movable body and the end onthe other side of the second movable body are in proximity within apredetermined distance or in contact with each other in the firstdirection and at least in a predetermined positional relation in asecond direction orthogonal to the first direction within thetwo-dimensional plane.
 21. An exposure apparatus which exposes an objectwith an energy beam via an optical system and liquid, the apparatuscomprising: the movable body apparatus according to claim 18 on whichthe object is mounted on the first movable body or the second movablebody, or on the first movable body and the second movable body; and aliquid immersion device which supplies liquid in a space directly belowthe optical system and forms a liquid immersion area between the opticalsystem and the first movable body or the second movable body or thefirst movable body and the second movable body, wherein delivery of theliquid immersion area is performed between the first movable body andthe second movable body in a state where the first movable body and thesecond movable body are in the first state.
 22. The exposure apparatusaccording to claim 21 wherein the first movable body is an object stageon which the object is mounted, and the second movable body is ameasurement stage on which a measurement member is provided.
 23. Theexposure apparatus according to claim 22 wherein in the object stage,the first magnet unit is placed substantially on an entire surface whichis a surface on a side facing the stage base, and in the measurementstage, the second magnet unit is placed in an area of a surface on aside facing the stage base, the area excluding a portion on one end inthe first direction which is on a side that can be in proximity with theobject stage.
 24. The exposure apparatus according to claim 21 whereinthe first movable body and the second movable body are both an objectstage on which the object is mounted.
 25. The exposure apparatusaccording to claim 24 wherein in the first movable body and the secondmovable body, a protruding portion which protrudes outwardly at least toone side in the first direction is provided in each of the upper endportions of the first movable body and the second movable body, and aprotruding dimension of the protruding portion in the first direction isdecided according to a dimension of the first direction driving coil inthe first direction.
 26. The exposure apparatus according to claim 21wherein exposure of the object is performed by scanning the objectmounted on the first movable body or the second movable body in thefirst direction with respect to the energy beam via the optical system.27. A device manufacturing method, including: exposing a sensitiveobject using the exposure apparatus according to claim 21; anddeveloping the object which has been exposed.